GAP AS-205 Y
GAP AS-205 Y can be used from room temperature to higher temperatures. Due to the very good adhesive properties you save time during vacuum build-up and it can be easily removed from a metal or composite mould after oven or autoclave curing without leaving any residue. It is compatible with all common polyester - epoxy - and phenolic resin systems.
GAP AS-199 Y
GAP AS-205 Y can be used from room temperature to higher temperatures. Due to the very good adhesive properties you save time during vacuum build-up and it can be easily removed from a metal or composite mould after oven or autoclave curing without leaving any residue. It is compatible with all common polyester - epoxy - and phenolic resin systems.